Semiconductor Equipment Corporation is a small innovative company that has designed and manufactured back end manual equipment for the semiconductor and related industries for more than 46 years. In that time we have expanded our business to distribute products for Nitto Denko and Hugle Electronics. We service everything we sell.

Our products serve a variety of market segments related to semiconductor manufacturing and electronics packaging. The products designed and manufactured by us are manual and semiautomatic systems. We also distribute products for two Market leading Japanese companies.

Nitto Denko manufactures dicing and grinding tape including revolutionary “Revalpa” heat release tape. They also have semi-automatic and fully automatic wafer mounters and de-mounters,

Hugle International manufactures cleaning equipment for FOUPs, RSPs, and wafer cassettes as well as dry cleaning equipment for displays.

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